therminic 2025
Naples | September 24-26, 2025
THERMINIC 2025
The 31st International Workshop on Thermal Investigation of ICs and Systems (THERMINIC 2025) was a great success, marking another milestone in the research of thermal issues in electronic components. The three-day event in Naples, Italy, brought together 140 delegates from 24 countries. Of these, 123 participants came from across Europe, namely, 37 from Italy, 21 from Germany, 10 from Hungary, 7 each from France and Ireland, 6 from Belgium and the UK, 5 from Spain and the Netherlands, and others from many more corners of the continent. We also welcomed 11 delegates from Asia (including 7 from the Republic of Korea) and 6 from North and South America (3 from Canada, 2 from Brazil, and 1 from the USA).
The audience, representing both academia (58%) and industry (42%), reflected the true spirit of THERMINIC, a blend of research excellence and industrial innovation. Participants came with a wealth of expertise, ranging from advanced technology development to strategic industrial management. Together they contributed three keynotes, 62 oral presentations and 36 posters, a short course preceding the workshop and their vast know-how and experience during the sessions and networking events.
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A true highlight of this year’s event was the Gala Dinner at Villa Doria d’Angri, beautifully located on the Posillipo hill and offering panoramic views of the city and the sparkling coastline of the Gulf of Naples. The villa’s elegant architecture, ornate interiors, and the exotic charm of its octagonal Chinese pagoda created an enchanting setting. The evening combined fine dining and lively exchange, providing the perfect opportunity for informal discussions and inspiring networking after a day of stimulating presentations.
We congratulate the winners of this year’s Best Paper Award, Vincenzo ‘Garibaldi’ Terracciano and his colleagues for their work on “Electrothermal Performance Enhancement of Silicon Carbide Gate-All-Around MOSFETs using a Ferroelectric Gate Stack”, as well as Yanan Wu and her colleagues for the best poster of the workshop (“Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed and Lock-In Thermography”). This year’s best young researcher award goes to Maik Sternberg for his paper on “Thermal‑Resistance‑Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load‑Cycling” – well done, everyone!
The organizers would like to thank our keynote speaker and all the presenters, session chairs, exhibitors and sponsors for their contribution to this exciting event.
We hope to see you all again at THERMINIC 2026 in Berlin.
Best regards,
Vincenzo d’Alessandro
THERMINIC 2025 Programme Chair
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