THERMINIC 2023/2024 Special Issue of MDPI Journal Energies

THERMINIC 2023/2024 Special Issue of the MDPI Journal Energies entitled “Thermal and Reliability Investigations in Electronics Components and Systems”

Energies is an open access journal of MDPI (approved by the “Norwegian” list; 2023 SCI ranking in engineering: Q1).

Extended versions of selected papers presented at the 2023 and 2024 THERMINIC editions (or other papers focusing on the same topics) can be submitted to this special issue; the submission deadline is April 30, 2025, but accepted and finalized papers will be immediately published online in Energies.

The Guest Editors of the THERMINIC 2023/2024 Special Issue of Energies are Prof. Andras Poppe and Prof. Marta Rencz.

The new content compared to the original full paper THERMINIC available on IEEE Xplore should amount to 50%.

Additional information related to this special issue can be found at the publisher: www.mdpi.com/journal/energies/special_issues/42E30U2O6D.

Prof.  A. Poppe and Prof. M. Rencz