Presentation Guidelines
ORAL PRESENTATION GUIDELINES
- Each oral presentation is scheduled to last 20 minutes in total, including Q&A. Given the very dense schedule, speakers are expected to finish their talk in about 17 minutes. We suggest using no more than 25 slides to ensure clarity and keep the audience engaged.
- There is no mandatory template for the slides. Presentations may be prepared either in widescreen (16:9) or standard (4:3) format.
- Presentations should not be uploaded in advance. Instead, speakers are asked to bring a USB memory stick with their slides in .pptx or .pdf format. Before each session, presenters must meet the session chair to upload their files to the dedicated computer folder. Presenters are responsible for checking that formulas, text, and animations display correctly.
POSTER PRESENTATION GUIDELINES
- Posters must be prepared in A0 format (84.1 cm × 118.9 cm). They will be affixed on dedicated boards located in the “Sala Polifunzionale” (Multipurpose Room) on the first floor of the Conference Center, in close proximity to the Aula Magna.
- There is no mandatory template for the poster.
- Poster viewing sessions will be preceded by a short oral presentation session in the Aula Magna, designed to attract participants to the poster boards for stimulating discussions. The same format and template rules as for oral presentations apply. Since 20 short presentations must fit within one hour, each presenter will have slightly less than 3 minutes, and thus it is strongly recommended to use no more than 4–5 slides. Please note that, due to time constraints, no questions can be raised immediately after the short presentation.
Full Paper Submission
All authors have been informed about the acceptance of their abstracts. The deadline for the submission of the camera-ready full papers is extended until September 5, 2025.
Oral presenters are requested to prepare a full paper of four to six pages. For poster presenters, the paper should be no longer than four pages.
Please note that we are using the standard IEEE paper template, it can be downloaded below both in docx- and in Latex-format.
The papers will be distributed in time for the conference.
Downloads
Word – Template: Download here (.docx/ 36 KB)
Latex – Template: Download here (.zip/ 835 KB)
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.
The paper upload is now possible via ConfTool. You will need to submit your full paper in pdf format. Please make sure to use the IEEE paper template provided on this page and to go through the IEEE Xpress pdf checker, before uploading your camera-ready paper through the conference system. The conference ID is 65879X.
While you are uploading the paper to ConfTool, you will also be asked to identify the presenting author and to provide a short bio of him or her.
Contact
In case you experience any problems with the submission process, please contact us at therminic@mcc-events.de.
Conference Topics:
Thermal Phenomena in Simulation & Experiment
- Thermal management of electronic components and systems
- Classical and modern thermometry and thermography
- Thermal interface materials and their characterisation
- Thermal modelling and investigation of packages
- Nano-scale heat transfer
- Multi-physics simulation and field coupling
- Electro-thermal modelling and simulation
- CFD modelling and benchmarking
- Advanced thermal materials and technologies
- Numerical methods for multi-scale heat transfer
- Use of novel, advanced mathematics and statistics concepts / AI methods for complex digital twins of components and systems
Electronics Cooling Concepts & Applications
- Cooling concepts: air, liquid, 2-phase, etc.
- Power electronics
- High temperature electronics
- Solid state lighting LED packages and LED based lighting solutions
- Thermo-electric and sub-ambient cooling
- Novel and advanced cooling technologies
- Heat pipe and vapor chambers
- 3D heterogenous integration and cooling, ultra low form factor air cooling
- Novel manufacturing methods
- Cooling for IoT, CPS, mobile, edge computing
- Thermal buffering for computational sprinting
- Battery thermal management
Thermo-Mechanical Reliability
- Thermo-mechanical reliability
- Prognostics and health monitoring
- Lifetime modelling and prediction
- Damage and fracture mechanics
- Failure analysis and inline inspection
Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. THERMINIC papers can be searched through IEEE, Google scholar and other search engines. Vendors and Book Exhibitors are invited to offer products in the scope of the Workshop. Exhibitor space is available – please contact local committee for further details. Editors are invited to exhibit books.